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Wi2Wi宣布WC7220B0藍(lán)牙低能耗(BLE)模塊

來源：http://www.element79mechanical.com 作者：億金電子 2024年03月05

Wi2Wi宣布WC7220B0藍(lán)牙低能耗(BLE)模塊

Wi2Wi宣布WC7220B0為同類最佳藍(lán)牙低能耗（BLE）模塊
Wi2Wi公司（“Wi2Wi”或“公司”），全球領(lǐng)先的端到端無線連接解決方案、高精度頻率控制、定時(shí)和微波濾波器設(shè)備開發(fā)商和制造商，很高興宣布WC7220B0石英晶振，一款超小型、超低功耗高性能藍(lán)牙低能耗（BLE）模塊，來自其MCU嵌入式（ME）系列產(chǎn)品。

“WC7220B0是Wi2W威爾威晶振公司豐富的連接產(chǎn)品組合中令人興奮的新成員，旨在滿足物聯(lián)網(wǎng)（IoT）和工業(yè)物聯(lián)網(wǎng)（IIoT/M2M）市場(chǎng)對(duì)超小型封裝產(chǎn)品性能的集成需求。嵌入式微控制器WC7220B0為最終客戶系統(tǒng)提供即插即用藍(lán)牙LE集成。在終端系統(tǒng)中采用該模塊將大大減少終端客戶的上市時(shí)間和整體產(chǎn)品開發(fā)成本。該公司將繼續(xù)專注于發(fā)布經(jīng)濟(jì)高效、同類最佳的即插即用無線連接解決方案，以支持物聯(lián)網(wǎng)和物聯(lián)網(wǎng)市場(chǎng)不斷增長(zhǎng)的需求。”董事會(huì)主席邁克爾·索南里奇說。

“WC7220B0滿足了行業(yè)對(duì)超小型和超低功耗、經(jīng)濟(jì)高效的即插即用藍(lán)牙LE模塊的需求，滿足了IoT和IIoT市場(chǎng)中各種傳感器應(yīng)用的需求。這是我們今年的第五款新產(chǎn)品，是該公司如何創(chuàng)造簡(jiǎn)單易用性來增強(qiáng)客戶產(chǎn)品的一個(gè)例子。該公司繼續(xù)專注于開發(fā)無線連接和頻率控制產(chǎn)品線中的一流產(chǎn)品。”Wi2Wi總裁兼首席執(zhí)行官Zachariah Mathews表示。

WC7220B0Wi2Wi的MCU嵌入式（ME）系列有源晶振是一款集成芯片天線的無主機(jī)單模藍(lán)牙低能耗（BLE 4.1/藍(lán)牙智能）模塊，具有業(yè)界最高的集成度，可提供一流的特性、性能和功能。這款獨(dú)立的藍(lán)牙LE模塊集成了微控制器、嵌入式BT LE 4.1堆棧和應(yīng)用配置文件，支持終端系統(tǒng)連接到個(gè)人區(qū)域網(wǎng)絡(luò)（PAN）中的任何智能手機(jī)、平板電腦或任何其他支持BLE的設(shè)備。WC7220B0BLE模塊是一個(gè)完全集成的子系統(tǒng)，包括MCU、MAC、基帶、RF前端、LNA、PA、晶體、濾波器、天線和EEPROM。這款超低功耗BLE模塊具有多種掉電模式，功耗低至納安，可提供出色的電池續(xù)航時(shí)間，并可使用CR2032等小型紐扣電池供電。額外內(nèi)存在WC7220B0使系統(tǒng)開發(fā)人員能夠在模塊中編寫用戶應(yīng)用程序，無需任何外部微控制器。該模塊提供多種接口，如UART和I2C。具有模擬、數(shù)字和PWM功能的GPIOs也可用于與外部多個(gè)外設(shè)和傳感器通信。WC7220B0非常適合智能健康、智能家居、智能能源、互聯(lián)網(wǎng)設(shè)備中的各種傳感器應(yīng)用以及智能制造中的各種傳感器應(yīng)用。
Wi2Wi的MCU嵌入式系列產(chǎn)品WC7220B0是一款集成芯片天線的無主機(jī)單模藍(lán)牙低功耗（BLE）模塊。這款獨(dú)立的BLE模塊具有板載微控制器、嵌入式BLE 4.1堆棧和應(yīng)用配置文件，使系統(tǒng)能夠連接到個(gè)人區(qū)域網(wǎng)絡(luò)（PAN）中的任何智能手機(jī)/平板電腦或任何其他支持BLE的設(shè)備。WC7220B0石英晶體振蕩器是業(yè)界最小的BLE模塊之一，它是一個(gè)子系統(tǒng)，包括MCU、MAC、基帶、RF前端、LNA、PA、晶體、濾波器和EEPROM。這款超低功耗BLE模塊具有多種掉電模式，功耗低至納安，可提供出色的電池續(xù)航時(shí)間，并可使用CR2032等小型紐扣電池供電。WC7220B0 -無主機(jī)BLE模塊中的額外內(nèi)存將使系統(tǒng)開發(fā)人員能夠編寫用戶應(yīng)用程序，并且無需任何外部微控制器。此外，具有模擬、數(shù)字和PWM功能的UART、I2C、GPIOs等接口也可用于與外部外設(shè)和傳感器通信。WC7220B0 -獨(dú)立ble模塊通過FCC、CE和IC認(rèn)證，并具有擴(kuò)展溫度等級(jí)；-30攝氏度至+85攝氏度。

該模塊已通過FCC、CE和IC認(rèn)證，并附帶開箱即用的集成工具，其中包含所有必需的協(xié)議棧、豐富的軟件庫（包括云訪問支持和示例應(yīng)用程序）。可根據(jù)要求提供樣品和開發(fā)套件。

Wi2Wi宣布WC7220B0藍(lán)牙低能耗(BLE)模塊

Wi2Wi announces WC7220B0 the Best in Class Bluetooth Low Energy (BLE) Module

Wi2Wi Corporation ("Wi2Wi" or the "Company"), a leading global developer and manufacturer of end to end Wireless Connectivity Solutions, high precision Frequency Control, Timing, and Microwave Filter devices, is pleased to announce WC7220B0, an Ultra-Small, Ultra-Low Power High Performance Bluetooth Low Energy (BLE) module, from its MCU Embedded (ME) family of products.

“WC7220B0 is an exciting addition to Wi2Wi's rich connectivity product portfolio addressing the integration demand for best in class performance in an ultra-small package footprint in the Internet of Things (IoT) and Industrial Internet of Things (IIoT/M2M) markets. The microcontroller embedded WC7220B0 provides plug and play Bluetooth LE integration to the end customer systems. Adopting this module in their end systems will substantially reduce the end customer’s time to market overall product development cost. The Company will continue to focus on releasing cost effective, best in class plug and play wireless connectivity solutions to support the ever growing demand of the IoT and IIoT markets.” said Michael Sonnenreich, Chairman of the Board.

“WC7220B0 answers industry’s demand for ultra-small and ultra-low power cost effective plug and play Bluetooth LE module demand for various sensor applications in the IoT and IIoT markets. This is our fifth new product this year and is an example of how the Company is creating simplicity and ease of use to enhance our customers’ products. The Company continue its focus in developing best in class products from both wireless connectivity and Frequency Control product lines. ” said Zachariah Mathews, President and CEO of Wi2Wi.

WC7220B0 from Wi2Wi's MCU Embedded (ME) Series is a Host-Less Single-Mode Bluetooth Low Energy (BLE 4.1/Bluetooth Smart) module with integrated chip antenna and has industry’s highest level integration that provides best in class features, performance and functionality. This self-contained Bluetooth LE module with integrated microcontroller, embedded BT LE 4.1 stack and application profiles enables the end system connect to any smartphone, tablet or any other BLE enabled devices in a Personal Area Network (PAN). WC7220B0 BLE module is a fully integrated subsystem that includes MCU, MAC, baseband, RF front-end, LNA, PA, crystals, filter, antenna and EEPROM. This ultra-low power BLE module with multiple Power-down modes consumes as low as nano amps which provides excellent battery life and can be powered with a small coin cell battery like CR2032. Extra memory in WC7220B0 enable the system developers to write user application programs in the module and eliminate the need for any external Microcontroller. This module provides multiple interfaces such as UART and I2C. GPIOs with Analog, Digital and PWM functionality are also available to communicate with external multiple peripherals and sensors. WC7220B0 is ideal for various sensor applications in the Smart Health, Smart Home, Smart Energy, Internet enabled devices and various sensor applications in Smart Manufacturing.

The module is being certified for FCC, CE, and IC and comes with out of the box integration tools with all the required protocol stacks, extensive software libraries including cloud access support and sample applications. Samples and Development kits are available upon request.

Type/Series	Package	Output	Frequency Range	Dimensions	Features
LV5	SMD Seam Welded	LVDS	40MHz to 200MHz	5.00mm x 3.20mm x 1.20mm	Low Phase Noise
LV7	SMD Seam Welded	LVDS	40MHz to 200MHz	7.0mm x 5.0mm x 1.8mm	3.3V and 2.5V Available
O08	DIP8	TTL/CMOS LVCMOS	30KHz to 200MHz	13.2mm x 13.2mm x 5.6mm	4-Pin E/D Optional
O14	DIP14	TTL/CMOS LVCMOS	30KHz to 200MHz	20.4mm x 12.8mm x 5.08mm	4 to 14 - Pin E/D Optional
OC2	SMD Seam Welded	TTL/CMOS LVCMOS	30KHz to 50MHz	2.5mm x 2.0mm x 1.0mm	Small Footprint
OC3	SMD Seam Welded	TTL/CMOS LVCMOS	30KHz to 80MHz	3.2mm x 2.5mm x 1.0mm	Small Footprint
OC5	SMD Seam Welded	TTL/CMOS LVCMOS	30KHz to 200MHz	5.0mm x 3.2mm x 1.3mm	Wide Frequency Range
OC7	SMD Seam Welded	TTL/CMOS LVCMOS	30KHz to 200MHz	7.0 x 5.0 x 1.8mm	5V Available
PE5	SMD Seam Welded	LVPECL	40MHz to 200MHz	5.0mm x 3.2mm x 1.2mm	Low Jitter
PE7	SMD Seam Welded	LVPECL	40MHz to 200MHz	7.0 x 5.0 x 1.8mm	E/D Optional
DH-1	Ceramic SMD	CMOS	32.768 KHz	7.86mm x 3.60mm x 2.00mm	Rugged Design Wide Operating Temp Range
DL-4	Ceramic J-Lead	LVCMOS	0.5MHz - 80MHz	8.89mm x 7.37mm x 4.32mm	Rugged Design Wide Operating Temp Range
FC7	SMD Seam Weld	LVCMOS LVDS LVPECL	10MHz to 1GHz	7.0mm x5.0mm x1.8mm	Rugged Design Wide Operating Temp Range
JC7	J Lead Gull Wing Thru Hole	TTL/CMOS LVCMOS HCMOS	30KHz - 200MHz	7.0mm x 5.0mm x 1.6mm
JL9	Ceramic J-Lead	TTL/CMOS LVCMOS HCMOS	30KHz - 200MHz	14mm x 9mm x 4.7 mm	E/D Optional
JL4	Ceramic J-Lead	TTL/CMOS LVCMOS	30KHz - 200MHz	8.9mm x 7.4mm x 4.3 mm	1.8V to 3.3V available